Description:

Multi-purpose phone BGA stencil template.
High precision and not easily deformed High Quality BGA stencil template for phone BGA chips.
Each type BGA reballing stencil template support a variety of BGA IC.
Used for motherboard CPU / audio / power IC / USB control IC or BGA IC repair.
Compatible with iPhone 6/6 Plus.

Specification:

Material: Metal
Size: Approx. 11.5*9*0.1 cm/4.53*3.54*0.04 inch

Package Includes:

1 Piece BGA Reballing Stencil