Description:

Ultra-small size;
Support serial to WiFi;
Wireless transparent transmission;
Long distance transmission with ultra-low power;
Bearing high temperature to 125 ℃, compared to the 85℃ for ESP8266.

Specification:

SOC characteristics
Built-in Tensilica L106 ultra-low power 32-bit CPU, main frequency supports 80MHz and160MHz, and RTOS;
Built-in TCP/IP protocol;
Built-in one-channel 10-bit high precision ADC;
Outboard interface: HSPI, UART, I2C, I2S, IR Remote Controk, PWM, GPIO;
Deep sleep current is 10uA, the cut-off current is smaller than 5uA;
Wake,connect and transmission data package within 2ms;
The consume power is smaller 1.0Mw (DTIM3) when at stand by status;
Built in 1M byte for SPI Flash.
WiFi characteristics
Support 802.11 b/g/n/e/I;
Support Station, Soft AP, Soft AP+STA mode;
Support WiFi Direct (P2P);
Support CCMP (CBC-MAC, computation mode), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC etc., for hardware acceleration.
P2P finding, P2P GO mode/ P2P power manage
WPA/PA2PSK and WPS;
802.11 securitycertification: pre-certification and TSN
Support 802.11n (2.4GHz);
802.1h/RFC1042 frame encapsulation;
Support seam less roaming;
Support AT remote update and cloud update (OTA);
Support Smart Config function (including Android and Ios device).
Module interface
2* UART;
1*ADC;
1*En;
1*wakeup pin;
1*HSPI;
1*I2C;
1*I2S
More than 10*GPIOs
Working temperature: -40℃-+125℃;
Module size:26.8mm*16mm
Application:Electronical appliance; Smart power plug, smart light;Infant monitor;Sensor networks;Security ID label;Wireless location beacon;Home automation;Mesh networks; IP video camera;Wearable electronics;Wireless location recognition;Industrial wireless control.

Package Includes:

1 Piece ESP-M3 Module